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In Situ Measurements of Stress Evolution in Silicon Thin Films During Electrochemical Lithiation and Delithiation

机译:硅薄膜应力演变的原位测量   电化学锂化和脱锂

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摘要

We report in situ measurements of stress evolution in a silicon thin-filmelectrode during electrochemical lithiation and delithiation by using theMulti-beam Optical Sensor (MOS) technique. Upon lithiation, due to substrateconstraint, the silicon electrode initially undergoes elastic deformation,resulting in rapid rise of compressive stress. The electrode begins to deformplastically at a compressive stress of ca. -1.75 GPa; subsequent lithiationresults in continued plastic strain, dissipating mechanical energy. Upondelithiation, the electrode first undergoes elastic straining in the oppositedirection, leading to a tensile stress of ca. 1 GPa; subsequently, it deformsplastically during the rest of delithiation. The plastic flow stress evolvescontinuously with lithium concentration. Thus, mechanical energy is dissipatedin plastic deformation during both lithiation and delithiation, and it can becalculated from the stress measurements; we show that it is comparable to thepolarization loss. Upon current interrupt, both the film stress and theelectrode potential relax with similar time-constants, suggesting that stresscontributes significantly to the chemical potential of lithiated-silicon.
机译:我们报告通过使用多束光学传感器(MOS)技术在电化学锂化和脱锂过程中硅薄膜电极中应力演变的原位测量。锂化时,由于基板的约束,硅电极最初会发生弹性变形,从而导致压应力快速上升。电极开始在约200的压缩应力下发生塑性变形。 -1.75 GPa;随后的锂化导致持续的塑性应变,耗散了机械能。脱锂时,电极首先会在相反方向经历弹性应变,从而导致拉伸应力为ca。 1 GPa;随后,它在其余的脱锂过程中发生塑性变形。塑性流动应力随着锂浓度的变化而连续变化。因此,在锂化和脱锂过程中,机械能都会在塑性变形中消散,并且可以通过应力测量来计算。我们证明它与极化损耗相当。在电流中断时,薄膜应力和电极电位都以相似的时间常数松弛,这表明应力对锂化硅的化学势有很大贡献。

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